A: Absolutely. Your files are confidential. We require written consent to share or reproduce them and can sign an NDA upon request.

A: Yes, we specialize in prototype and low-volume PCB production.

A: 10 pieces

A: Yes, included at no extra cost.

A: Yes, overlapping drills are supported.

A: Yes. While our pricing is already highly competitive, we are open to discussion to help you meet cost targets.

A: PCB cost depends on several factors, including:
2. Number of layers
3. Panelization efficiency
4. Number of drilled holes
5. Number of hole sizes (tool changes slow down production)
6. PCB laminate material (choosing the right material can save cost for volume production)
7. Trace width and part spacing (impacting manufacturing yield)
8.Special requirements, such as controlled impedance, via-in-pad, blind/buried vias, microvias, etc., which can affect yield and complexity.

A: Our standard laminate thickness is 1.6 mm (0.063").

A: 0.3mm, 0.4mm 0.6mm 0.8mm 1.0mm 1.2mm 2.0mm 2,4mm ,3.0mm 3.2mm 4mm, 6mm

A: Yes, we can .

A: We can offer 0.5 oz, 1.0 oz, 1.5 oz, 2.0 oz, 2.5 oz, 3.0 oz, and Heavy Copper PCB options at 3.5 oz, 4.0 oz, 4.5 oz, and 5.0 oz.

A: We can process Gerber RS-274X and ODB++ files.

A: No, as these formats do not translate to our PCB Fabrication machinery.

A: We use high-quality green Liquid Photo Imageable (LPI) solder mask for our PCB production.

A: No. Solder mask is included as a standard option for prototypes, so it does not increase the cost.

A: We offer green, black, blue, red, yellow, purple, and white solder masks.

A: HASL, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Hard Gold, and Soft Gold, and more.

A: PCBAMake specializes in turnkey services. Required files include: BOM, Gerber/ODB++ designs, fabrication/assembly drawings, and project-specific instructions. We also offer preliminary quotes for incomplete designs using early Gerber files. See below for file details.

A: Drill files (including blind/buried vias) Mechanical files (board outline, cutouts, routing) ODB++ archives are accepted and contain all fabrication data.

A: Specifies component locations (X/Y coordinates), rotation, layer, designator, and package details.

A: BOM lists all board components, including DNI (Do Not Install) parts.

A: Include documentation for impedance control, gold fingers, blind/buried vias, or custom stackups (PDF/ReadMe preferred).

A: PDF files showing component placement when board space is limited.

A: Available for unfinished designs using early Gerber files or descriptions. Final quotes issued after design completion.