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BGA PCB Assembly

PCBAMake has been providing BGA assembly, including BGA Rework and BGA Reballing services in the Printed Circuit Board Assembly industry since 2003. With state-of-the-art BGA placement equipment, high-precision BGA assembly processes, cutting-edge X-Ray Inspection equipment, and highly customizable Complete PCB Assembly solutions, you can rely on us to build high quality and high yield BGA boards.

BGA (Ball Grid Array) assembly is one of the most advanced SMT (Surface Mount Technology) processes used in modern electronics manufacturing.

At PCBAMake, we specialize in precision BGA soldering and rework, ensuring reliable connections, strong mechanical integrity, and excellent electrical performance for complex PCB designs.

Our production line supports various BGA types — from standard BGAs to micro-BGA and CSP packages — enabling high-density circuit assembly for advanced applications.

Benefits of Our BGA PCB Service
Efficient Use of Space
BGA PCB layout allows us to efficiently use the available space. Hence, we can mount more components and manufacturer lighter devices.
Excellent Thermal and Electrical Performance
Actions consistent with words Maintain Excellent Workforce
Customer service oriented
Quick to respond
Flexible
Highly productive
Higher Manufacturing Yields
The most BGA PCB design is smaller in size so they are faster to manufacture. Hence, we get higher manufacturing yields and the process becomes more convenient.
 
Less Damage to Leads
We use solid solder balls for manufacturing BGA leads. Hence, there is a lesser risk that they will get damaged during operation.
 
 
 
 
 
 
Lower Cost
The smaller size and the convenient manufacturing route ensure that we incur lower manufacturing costs. Hence, this process is ideal for mass production.
Our BGA Assembly Capability
BGA soldering, BGA Rework & Reballing'

You may have only a few BGAs or fine pitch parts on your PC boards that require PCB assembly for R&D prototyping. We provide a specialized BGA soldering service for testing and evaluation purposes and we can assist you with BGA rework and BGA reballing at an affordable price!

We follow five basic steps to perform BGA rework: component removal, site preparation, solder paste application, BGA replacement, and Reflow Soldering. We guarantee that 100% of your boards will be fully functional when they are returned to you.

BGA Assembly Capability

Minimum BGA pitch: 0.25 mm

BGA ball size range: 0.1 mm to 0.76 mm

Component size support: 01005 to large-size BGAs

Reflow soldering with precise temperature control

X-ray inspection for hidden joint verification

Automated optical inspection (AOI) for positioning accuracy

BGA reballing and rework capability

 
Types of BGA Assembly We Served
 
 
PBGA (Plastic Ball Grid Array)
PBGA, short for plastic ball grid array, was invented by Motorola and now has received the widest focus and applications.
TBGA (Tape Ball Grid Array)
TBGA, short for tape ball grid array, is capable of effectively shrinking package thickness and providing excellent electrical performance.
CBGA (Ceramic Ball Grid Array)
As is its name defined, CBGA (ceramic ball grid array) packages take advantage of ceramic as substrate material and tin balls (ratio between tin and lead: 10:90) with high melting point.
How We Do BGA Assembly

1.PCB pad preparation and stencil printing

2.BGA placement with automated pick-and-place machines

3.Controlled reflow soldering

4.X-ray inspection for solder joint analysis

5.Functional and visual testing

6.Rework or reballing if necessary

Each step is performed under strict process control to ensure high yield and reliability.

BGA Quality Control & Inspection
We mostly use X-ray inspection for analyzing the features of BGA PCBs. This technique is known as XRD in the industry and relies on X-rays for unveiling the hidden features of this PCB. This kind of inspection reveals,

1. 3D X-ray inspection (AXI) – to verify hidden solder balls

2. BGA void rate control < 5%

3. IPC-A-610 and IPC-7095 compliance

4. Rework station with temperature profiling

5. Moisture sensitivity control for BGA packages

 
 
 

FAQ

Q

How long have you been making PCB&PCBA?

A

PCBAMake has been making PCBs for more than 26 years.We built our assembly plant and begin assembly business in 1996.

Q

How do I get a quick quote for PCB or PCB assembly?

A

Please send your files and requirements to Orders@pcbamake.com.Quote will be sent back as soon as we get through an evaluation.

Q

Do you cater SMT prototype boards?

A

Yes, we are fully equipped to handle your any kind of custom SMT prototype board requirements.MOQ is 10 PCS.

Q

What files and documents do you request for my PCBA orders?

A

To ensure accurate and efficient assembly, we require Gerber files (including all layers), a complete Bill of Materials (BOM) in Excel format, Centroid data (Pick and Place file), and any additional requirements or assembly instructions if applicable.

WHAT CAN I DO FOR YOU ?

   * Only zip or rar files accepted. Max 18MB.

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