poe@pcbamake.com 
The superior thermal conductivity of ceramics pcb is the main reason why more and more industries shift to ceramics for PCB design.
Material: Al2O3 / BeO / AlN / metal oxide ceramics
Finish treatment: Immersion Gold, gold plating, immersed silver, OSP, immersed nickel-palladium
Copper thickness: 1oz~ 2oz
Resin plugging vias & Buried vias
Impedance Controller Board
| Feature | Technical specification |
|---|---|
| Number of layers | 4 - 22 layers standard, 40 layers advanced |
| Technology highlights | Ceramic PCB's current carrying capacity, heat dissipation performance, insulation and high reliability are all better than ordinary PCB, and it can operate stably in environments with high temperature and humidity. |
| Ceramic PCB | 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D |
| Materials | Alumina ceramics, aluminum nitride, ceramics high borosilicate glass, Shi Ying glass, silicon nitride |
| Copper weights (finished) | 18μm - 70μm |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.38mm, 0.5mm, 0.635mm, 0.8mm, 1.0mm, 1.5mm, 2.0mm |
| Material Size | 50*50, 7.62*7.62, 114*114, 120*120, 127*127, 138*190 mm |
| Surface finishes available | OSP, ENIG, Immersion tin, Immersion silver, Gold fingers |
| Minimum mechanical drill | 0.15mm |
| Minimum laser drill | 0.10mm standard, 0.075mm advanced |
With continued demands for miniaturization, microelectronics, and high-power LED packaging, substrates that can withstand high operating temperatures while providing excellent thermal performance are required. Ceramic PCBs have become a more viable option for PCB designers.
Ceramics have been widely used in electronic/electronic components for many years due to their advantages in thermal and mechanical properties. Since its introduction, ceramic PCBs have received great attention from the industry as an effective solution to a range of electronic problems.
Advantages of ceramic pcb compared to other technologies
Heat dissipation is a key advantage of ceramics over traditional materials such as FR4 and metal-clad PCBs. Since the components are placed directly on the board and there are no isolation layers, the heat flow through the board is much more efficient.
In addition to this, ceramic materials can withstand high operating temperatures (up to 500°C) and have an extremely low coefficient of thermal expansion (CTE), providing additional compatibility options for circuit designs.
Ceramic pcb advantage performance parameters
Excellent thermal conductivity (up to 170W/mK)
Operating temperature up to 500°C
Low thermal expansion coefficient
Suitable for high frequency applications due to low signal loss
The water absorption rate is 0%, and it is sealed and packaged with good air tightness.
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